iLab Name	C - Plasma-Therm Versaline DSE Deep Silicon Etcher
iLab Kiosk	BRK Etch Core
FIC
Owner	Francis Manfred
Location	BRK 2100K
Max. Wafer	200 mm / 8 in
Info Links	SOP \| Internal \| Staff

Overview

General Description

This is a Deep Silicon Etcher (DSE) that uses the Bosch process. This tool replaces the STS Advanced Silicon Etcher (ASE).

Specifications

This is a Deep Silicon Etcher (DSE) that uses a 3-step Bosch process (Passivation - Etch - Etch).

Max ICP power is 3,500w and max Bias Power is 600w

Available gases are C4F8, SF6, Ar & O2.

Sample Requirements and Preparation

Samples that may be used in the tool, materials that are compatible/incompatible, and the required cleaning before the tool may be used. May include both an "ideal" clean and a minimum required clean. Also include BOE/oxide removal, dehydration, or any recommended post process steps.

Standard Operating Procedure

Standard procedure for tool operation, base off established Birck SOPs.

Process Control Information

Process Control Context

Process Control Information Context

Process Control Charts

Click here to expand...

Questions & Troubleshooting

Question about tool use or process result?
Answer to question.

Process Library

Create process template for tool, allows a user to fill in the details of their process.

References

Manufacturer brochures, specifications, papers with relevant info on process, and presentations covering the technology. Confluence lacks a native reference feature, so these are added as links.

Plasma-Therm Versaline DSE Deep Silicon Etcher