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Overview

General Description

This is a Deep Silicon Etcher (DSE) that uses the Bosch process. This tool replaces the STS Advanced Silicon Etcher (ASE).

Specifications

This is a Deep Silicon Etcher (DSE) that uses a 3-step Bosch process (Passivation - Etch - Etch).

• Max ICP power is 3,500w and max Bias Power is 600w

• Available gases are C4F8, SF6, Ar & O2.

Sample Requirements and Preparation

Samples that may be used in the tool, materials that are compatible/incompatible, and the required cleaning before the tool may be used. May include both an "ideal" clean and a minimum required clean. Also include BOE/oxide removal, dehydration, or any recommended post process steps.

Standard Operating Procedure

Process Control Information

Process Control Context

Process Control Charts

Questions & Troubleshooting

Question about tool use or process result?
Answer to question.

Process Library

Create process template for tool, allows a user to fill in the details of their process. 

References

Manufacturer brochures, specifications, papers with relevant info on process, and presentations covering the technology. Confluence lacks a native reference feature, so these are added as links.

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