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Problem Reporting Guide
Problem Reporting Guide
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StatusUp
Issue Date and Description

10/28/2024 Tool will be offline for breaker work

Estimated Fix Date and Comment
Contingent on speed of electrical work
Responding StaffDave Lubelski/Dan Witter


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e-Log Link - Sputtering System
e-Log Link - Sputtering System
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iLab NameC - PVD Sputtering System - Flexible Substrate Compatible
iLab KioskBRK Evaporation Sputtering Core
FICHugh Lee
OwnerDave Lubelski
LocationCleanroom - S Bay
Max. Wafer4"/100 mm



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Current SourcesAl2O3, W, Co(20)Fe(60)B, TaAu
Potential SourcesSiO2, TiN, Au, Ti, Ag, Cu, Si3N4, Al, Ni, Si, NbTi, Cr, Ge, Pt, Ni/Ti, Nb, Ta, ITO, MgO, W, Al2O3, CoFeB, TiO2




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Overview

General Description

  • Can Accommodate Substrates Up to 4"dia.
  • Reactive Sputtering Capable
    • Water Cooled Stage
    • 4-gun System
  • Base Pressure 2.0x10-6 Torr
  • Gases available N2, Ar, O2

Specifications

For use with substrates of organic materials, polyimides, parylene, etc.

Technology Overview 


Sample Requirements and Preparation

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Materials in Vacuum
Materials in Vacuum
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Standard Operating Procedure

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namePVD Flex Sputter SOP.docx
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Please Note: This instrument is billed per  use  based on a 2 hour block

Example : 1  user only uses the tool  per use.  When you vent the system and unload your sample that concludes your reservation .  

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses


Questions & Troubleshooting



Process Library


References