PVD Sputtering System - Flexible Substrate Compatible

PVD Sputtering System - Flexible Substrate Compatible



Status

UP

Issue Date and Description

8/19/2025 Back right magnetron is shorted. This may be due to magnetron damage or slight misalignment of the target. Other 3 magnetrons are available and working

Estimated Fix Date and Comment

10/9/2025 Back right magnetron functionality restored. Previously-installed shield was shorting the magnetron.

Responding Staff

Dave Lubelski/Dan Witter





iLab Name

C - PVD Sputtering System - Flexible Substrate Compatible

iLab Kiosk

BRK Evaporation Sputtering Core

FIC

Hugh Lee

Owner

Dave Lubelski

Location

Cleanroom - S Bay

Max. Wafer

4"/100 mm







Current Sources

Pt, Ti, SiO2, Au

Potential Sources

SiO2, TiN, Au, Ti, Ag, Cu, Si3N4, Al, Ni, Si, NbTi, Cr, Ge, Pt, Ni/Ti, Nb, Ta, ITO, MgO, W, Al2O3, CoFeB, TiO2









Overview

General Description

  • Can Accommodate Substrates Up to 4"dia.

  • Reactive Sputtering Capable

  •  

    • Water Cooled Stage

    • 4-gun System

  • Base Pressure 2.0x10-6 Torr

  • Gases available N2, Ar, O2

Specifications

For use with substrates of organic materials, polyimides, parylene, etc.

Technology Overview 



Sample Requirements and Preparation



Standard Operating Procedure

Please Note: This instrument is billed per  use  based on a 2 hour block

Example : 1  user only uses the tool  per use.  When you vent the system and unload your sample that concludes your reservation .  

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses



Questions & Troubleshooting




Process Library


References