PVD Sputtering System - Flexible Substrate Compatible
Status | UP |
|---|---|
Issue Date and Description | 4/30/26 Substrate rotation Water leak |
Estimated Fix Date and Comment | Received the quote from PVD for the replacement part, waiting for more instructions |
Responding Staff | Ethan Zhang |
iLab Name | |
|---|---|
iLab Kiosk | |
FIC | Hugh Lee |
Owner | Ethan Zhang |
Location | Cleanroom - S Bay |
Max. Wafer | 4"/100 mm |
Current Sources | Pt, Ti, Au, SiO2 |
|---|---|
Potential Sources | SiO2, TiN, Au, Ti, Ag, Cu, Si3N4, Al, Ni, Si, NbTi, Cr, Ge, Pt, Ni/Ti, Nb, Ta, ITO, MgO, W, Al2O3, CoFeB, TiO2 |
Overview
General Description
Can Accommodate Substrates Up to 4"dia.
Reactive Sputtering Capable
Water Cooled Stage
4-gun System
Base Pressure 2.0x10-6 Torr
Gases available N2, Ar, O2
Specifications
For use with substrates of organic materials, polyimides, parylene, etc.
Technology Overview
Sample Requirements and Preparation
Standard Operating Procedure
Please Note: This instrument is billed per use based on a 2 hour block
Example : 1 user only uses the tool per use. When you vent the system and unload your sample that concludes your reservation .
Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses
Questions & Troubleshooting
Process Library