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Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUp
Issue Date and Description

10/28/2024 Tool will be offline for breaker work

Estimated Fix Date and Comment
Contingent on speed of electrical work
Responding StaffDave Lubelski/Dan Witter


iLab KioskeLog: SubmiteLog: View/EditReport ProblemMSDS Documents


iLab NameC - PVD Sputtering System - Flexible Substrate Compatible
iLab KioskBRK Evaporation Sputtering Core
FICHugh Lee
OwnerDave Lubelski
LocationCleanroom - S Bay
Max. Wafer4"/100 mm


Current SourcesAl2O3, W, Co(20)Fe(60)B, Au
Potential SourcesSiO2, TiN, Au, Ti, Ag, Cu, Si3N4, Al, Ni, Si, NbTi, Cr, Ge, Pt, Ni/Ti, Nb, Ta, ITO, MgO, W, Al2O3, CoFeB, TiO2

Overview

General Description

  • Can Accommodate Substrates Up to 4"dia.
  • Reactive Sputtering Capable
    • Water Cooled Stage
    • 4-gun System
  • Base Pressure 2.0x10-6 Torr
  • Gases available N2, Ar, O2

Specifications

For use with substrates of organic materials, polyimides, parylene, etc.

Technology Overview 


Sample Requirements and Preparation


Spin on Polyimide sample for metal deposition must be prepared in cleanroom.

  • Thickness: < 13um
  • Soft bake above 120 C longer than 30 seconds.
  • Curing in cleanroom /wiki/spaces/BNCWiki/pages/6228522 at:
    • 1) 200C for a minimum of 30 minutes
      Followed by: 
    • 2) A minimum of 300 C for a minimum of 60 minutes
  • Gradual cooling to room temperature (cooling overnight)


Standard Operating Procedure

Please Note: This instrument is billed per  use  based on a 2 hour block

Example : 1  user only uses the tool  per use.  When you vent the system and unload your sample that concludes your reservation .  

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses


Questions & Troubleshooting



Process Library

References


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