Page Comparison

1. Cleanliness
2. Solvents
3. Adhesion Promotion
4. Photoresists
5. Development
6. Lift off and metal adhesion
   
   

List of pages to be added:

1. Photoresist Spin Coating
2. Edge bead Removal
3. Pre-exposure bake
4. Post-exposure bake
5. Multilayer spins
6. Characterization of spun films
7. Etch resistance

Lithographic Processing Overview:

ICs, Lithography, and Photoresist - Henderson Research Group, GA Tech

University Nanofabrication/Cleanroom resources:

• UPenn - Singh Center for Nanotechnology
• nanoFAB - University of Alberta
• CMI - EPFL
• University of Utah - Nanofab

Manufacturer resources:

• MircroChemicals - Application Notes