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  1. Cleanliness
  2. Solvents
  3. Adhesion Promotion
  4. Photoresists
  5. Development
  6. Lift off and metal adhesion

List of pages to be added:

  1. Edge bead Removal
  2. Pre-exposure bake
  3. Post-exposure bake
  4. Multilayer spins
  5. Characterization of spun films
  6. Etch resistance

Lithographic Processing Overview:

ICs, Lithography, and Photoresist - Henderson Research Group, GA Tech

 

University Nanofabrication/Cleanroom resources:

 

Manufacturer resources:

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