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iLab Name: N/A
iLab Kiosk:N/A
FIC:
Owner: Mihailo Bradash
Location: Cleanroom
Maximum Wafer Size:
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Overview
General Description
Multi-Purpose Manual Die Bonder for applying temperature, pressure, and ultrasonic during bonding processes.
Specifications
Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 500N.
Technology Overview
Sample Requirements and Preparation
Standard Operating Procedure
Questions & Troubleshooting
Process Library