| Page Properties | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||||
|
iLab Name: N/A
iLab Kiosk:N/A
FIC: Tim Sands
Owner: Nithin Raghunathan
Location: BRK 1217
Maximum Wafer Size: N/A
| Table of Content Zone | ||||||||
|---|---|---|---|---|---|---|---|---|
| ||||||||
|
Overview
General Description
Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes.
Specifications
Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity
Technology
Overview - Remove if multiple tools use the same technology/processOverview
Sample Requirements and Preparation
Standard Operating Procedure
Questions & Troubleshooting
Process Library
References