CrossLab Name: N/A
FIC: Tim Sands
Owner: Nithin Raghunathan
Location: BRK 1217
Maximum Wafer Size: N/A

Overview

General Description

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes.

Specifications

Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity

Technology Overview - Remove if multiple tools use the same technology/process

Sample Requirements and Preparation

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References