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Page Properties
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Problem Reporting Guide
Problem Reporting Guide
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1/31/2024 - Issue with RF power supplies is such that the correct setting for programming isn't saved by the supply. One additional step must be done prior to deposition by the user - contact Dan for information. Tool runs normally otherwise
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Issue Date and Description

110/29/2024 - RF power supplies not working. 1/9/2024 - Z-Stage motor error.  Feedthrough has broken - replacement needs to be installed28/2024 Breaker work delayed, cancel previous plan

Estimated Fix Date and Comment


Responding StaffDave Lubelski/Dan Witter


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e-Log Link - Sputtering System
e-Log Link - Sputtering System
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iLab NameC - PVD Sputtering System - Flexible Substrate Compatible
iLab KioskBRK Evaporation Sputtering Core
FICHugh Lee
OwnerDave Lubelski
LocationCleanroom - S Bay
Max. Wafer4"/100 mm



Page Properties
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Current SourcesSiO2, CuAl2O3, W, Co(20)Fe(60)B, Au, Ti 
Potential SourcesSiO2, TiN, Au, Ti, Ag, Cu, Si3N4, Al, Ni, Si, NbTi, Cr, Ge, Pt, Ni/Ti, Nb, Ta, ITO, MgO, W, Al2O3, CoFeB, TiO2




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Overview

General Description

  • Can Accommodate Substrates Up to 4"dia.
  • Reactive Sputtering Capable
    • Water Cooled Stage
    • 4-gun System
  • Base Pressure 2.0x10-6 Torr
  • Gases available N2, Ar, O2

Specifications

For use with substrates of organic materials, polyimides, parylene, etc.

Technology Overview 


Sample Requirements and Preparation

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Materials in Vacuum
Materials in Vacuum
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Standard Operating Procedure

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Please Note: This instrument is billed per  use  based on a 2 hour block

Example : 1  user only uses the tool  per use.  When you vent the system and unload your sample that concludes your reservation .  

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses


Questions & Troubleshooting



Process Library

References