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Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusShutdown - Longterm
Issue Date and Description


Estimated Fix Date and Comment
Controller board issue
Responding StaffTim Miller


iLab Name: K and S 4526
iLab Kiosk: BRK Packaging and Assembly Core
FIC: David Janes
Owner: Tim Miller
Location: BRK 2261
Maximum Wafer Size: 

Overview

General Description

These systems use gold wire to bond. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

Specifications

The West Bond bonder has 25 micron gold wire and is operated manually. The K&S bonder has a wire size of 125 microns by 25 microns and may be operated manually or by programming. The pads must be larger than the size of a wire bond foot. Wire bond feet are typically 50 microns in width and 75 microns long. The recommended pads are 100 x100 microns minimum size on both chip and package for the West Bond. 100 x 150 microns for the K&S Ribbon Bonder.

Technology Overview - Remove if multiple tools use the same technology/process

 

 

Sample Requirements and Preparation

 

Standard Operating Procedure


Questions & Troubleshooting


 

Process Library

References

 

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