CrossLab Name: SB6e bonder
FIC: David Janes
Owner: Mike Courtney
Location: Cleanroom - Bay N
Maximum Wafer Size: 4"/100 mm

Overview

General Description

The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are mechanically clamped using the transport fixture for further processing in the SB6e chamber.

Specifications

4 inch wafer size for bonding Vacuum down to 5x10^-5 mbar. Over pressure up to 3 bar absolute Flexible process control using Windows NT with data recording and analysis Optimized bonding routines can be replicated

Technology Overview - Remove if multiple tools use the same technology/process

Sample Requirements and Preparation

Standard Operating Procedure

Questions & Troubleshooting

Process Library

References