TA Instruments DHR-3 Rheometer



2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff




iLab NameTA Instruments DHR3 Rheometer
iLab KioskBRK Roll to Roll Technology Core
FIC

Mukerrem Cakmak

Owner

Nicholas Glassmaker

LocationBRK 1154
Info LinksInternal | Staff

Overview

General Description

The TA Instruments DHR-3 Discovery Hybrid Rheometer is a highly versatile instrument that characterizes mechanical behavior of liquids, viscoelastic materials, and solids as a function of shear rate, oscillation frequency, time, and/or temperature.  There are several test modes and geometries available.  Flow mode allows a user to measure viscosity as a function of shear rate, stress, time, and/or temperature.  Oscillation mode allows a user to measure viscoelastic properties, such as G', G'', and tan(δ) as a function of frequency, stress/strain, time, and/or temperature.  Step Transient mode allows a user to set up creep and stress relaxation tests to measure compliance, relaxation modulus, and other parameters associated with time-dependent material behavior.  Finally, Dynamic Mechanical Analysis (DMA) mode allows measurement of viscoelastic properties of solids via tensile, bending, or torsional tests.  The various geometries allow certain tests, material states, or quantities of material to be used successfully.  Geometries available are upper cone (25 or 40 mm), upper plate (8 or 25 mm), lower Peltier plate with precise temperature control, 25 mm lower plate for use with environmental test chamber, concentric cylinders, three-point bending (solid materials), linear tension (solid materials), and the UV curing accessory.  A summary of the various test modes and geometries is given in the graphic below (click to download and enlarge).

Environmental Control

Precise temperature control is critical to many rheological measurements, as the mechanical behavior under study is often sensitive to temperature.  Various strategies are available for environmental control, but not all geometries allow the same temperature range and heating rate.  Please see the Specifications section below for more details.  In addition to temperature control, humidity control accessories are available.  (In most cases, samples are adequately contained so that the exposure to ambient relative humidity at the edge is not significant.  However, for moisture sensitive samples, this can be an important option.)  Some geometries also have partial or complete traps to reduce or eliminate evaporation of volatile solvents from samples during testing.

Dielectric Test Mode

In addition to the mechanical tests already described, the appropriate geometry accessories and an LCR meter are available for testing dielectric properties.

Specifications

The Peltier plate allows temperature control (from below only) from 0 to 200°C and heating rate up to 20°C/min. 

The Peltier concentric cylinders allows temperature control (from outside only) from 0 to 150°C and heating rate up to 13°C/min. 

The environmental test chamber (ETC) allows temperature control from -160 to 600°C and heating rate up to 60°C/min

Technology Overview

 


Sample Requirements and Preparation


Standard Operating Procedure


Questions & Troubleshooting



Process Library


References