Surface Characterization


Omicron surface analysis cluster

  • X-ray photoelectron spectroscopy (XPS) -- surface chemical composition
  • low energy electron diffraction (LEED) – macroscopic surface structure
  • state-of-the-art UHV scanning tunneling microscopy and atomic force microscopy (STM/AFM) – atomic arrangement
  • high-resolution electron energy loss spectroscopy (HREELS) -- vibrational structure (adsorbed species, phonons, etc.)
  • synthesize a material with required surface composition under UHV and to perform full characterization without taking the sample out
  • UHV treatment chamber (120 K – 1000 K), various gasses including metal-organic precursors, mass-spectrometer, also following deposition capabilities:
    • e-beam evaporators (2 sources for simultaneous use)
    • thermal evaporators (Zn, Te, Bi, Se; other metals possible)
    • sputtering source for refractory metals (Ta, etc.)
    • gas manifolds for UHV atomic layer deposition (ALD)
    • atomic hydrogen source, etc.

Kratos Axis Ultra DLD imaging XPS instrument 

  • Monochromatic X-ray source to minimize radioactive and thermal damage and improve the resolution
  • Charge neutralizer to study non-conducting samples minimizing non-homogeneous charge and improving the resolution
  • Real time imaging XPS to allow x- y- chemical mapping
  • Reaction cell (CatCell) to treat samples under different gas mixtures up to 6 bar at up to 1000°C, the transfer between the CatCell and the analysis chamber is under UHV without any contact to air
  • Sputtering gun, which can use either Ar+ or coronene (C24) for non-destructive depth profiling
  • UV-lamp to perform Ultra-Violet Photoemission Spectroscopy (UPS)
  • Ar-filled glove-box attached directly to the entry-lock of the XPS instrument to analyze air- and moisture sensitive samples (for instance Li ion battery or transition metal dichalcogenides, etc.)

Panalytical MRD X'Pert Pro high resolution x-ray diffractometer (XRD)

  • thin films, both single crystal and polycrystalline (diffraction & XRR), size up to 4” wafer
  • Anton Paar DHS 900 domed hot stage for measurements up to 900°C
  • Crystal orientation/offcut
  • Degree of crystallinity
  • Stresses/strain of single crystal thin film
  • Spatial mapping (100 x 100 mm motion) of sample surfaces
  • High speed wide angle x-ray diffraction and fast mode reciprocal space mapping
  • Density and film thickness determination (x-ray reflectivity XRR)
  • Pole figure
  • Low angle measurement as low as 0.1 °

Senior Research Scientist in charge: Dmitry Zemlyanov