2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.

Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

Status	UP
Issue Date and Description
Estimated Fix Date and Comment
Responding Staff

iLab Name: Accretech SS20
iLab Kiosk: BRK Packaging and Assembly Core
FIC: Shared
Owner: Mihailo Bradash
Location: BRK 1254
Maximum Wafer Size: 8"/200 mm

Overview

General Description

The Accretech SS20 dicing saw is a precision sawing machine used in cutting semiconductor and MEMS wafers for separation of individual chips or devices. Pieces to be cut are mounted on wafer tape, which allows any size and shape of sample to be cut, up to 8 inches in diameter, and up to 1 millimeter thick. A supply of blades is on hand for most common substrates. Unusual substrates or non-standard cutting dimensions (i. e. extremely narrow kerf) may necessitate ordering special blades. There may be an extra cost to order special blades.

Specifications

Technology Overview

Sample Requirements and Preparation

No special sample preparation is required. Users have the option of applying a sacrificial layer of photoresist to the top surface of the sample prevent surface damage.

Samples over 1 mm thick require special handling and specific blades. Please consult Tim Miller or Mihailo Bradash before attempting to cut anything over 1 mm in thickness.

Standard Operating Procedure

Questions & Troubleshooting

Blade changes:

Under no conditions should a user try to replace a broken blade! Please contact Tim Miller or Mihailo Bradash to have it replaced.

Common issues:

Expand selection

Below you will find some common issues, their probable causes and solutions.

Blade damage/break detected:

Causes

Sample size in recipe was too small.
Sample is too far off center axis of tool.
Sample material is incompatible for the type of blade used on machine.

Solution

First contact Tim Miller or Mihailo Bradash to perform a blade change on the tool.
After blade change has been performed confirm material is compatible, if material is correct increase sample size safety tolerance in Recipe.

Alignment is out of tolerance: