Status	Down
Issue Date and Description	2/26/2026 High voltage interlocks do not function
Estimated Fix Date and Comment	Dan is sourcing replacement interlocks - ETA not yet known
Responding Staff	Dave Lubelski/Dan Witter/Ethan Zhang

iLab Name	C - CHA E-Beam Evaporator #2
iLab Kiosk	BRK Evaporation Sputtering Core
FIC	Shared
Owner	Dave Lubelski
Location	Cleanroom - L Bay
Max. Wafer	4"/100 mm
Internal Page
Staff Page	Staff - CHA E-Beam Evaporator #2

Current Sources	Ti, Ag, Ni, Au, Pt, Ge
Potential Sources	Ti, Au, Pt, Al, Ni, Ge, Cr, Ag, NiCr (80/20)

Overview

General Description

Telemark 861 deposition controller
Six pocket e-beam evaporator
Pockets hold 8.2 cc crucible liners
Substrate fixture can hold 1- 6" wafer 4" wafers with adapters for a 3" wafer, 2" wafer, and fragments of wafers
Water cooled stage

_{RESULTS FROM TOOL CHARACTERIZATION AS OF 1/24/2020}

material deposited on clean pattered wafer	deposition rate	thickness setting	characterized result
using PR lift off process measured on P7
CHA2
Ti	2 a/s	50 nm	49.9 nm
Au	2 a/s	50 nm	49.4nm
Ni	2 a/s	50 nm	48.3 nm
Pt	2 a/s	50 nm	51 nm
Ag	2 a/s	50 nm	48.8 nm
Ge	2 a/s	50 nm	49.8 nm
Ti	1 a/s	5 nm	5nm
Ti/Au	Ti 1 a/s Au 2/as	5 nm Ti 50nm Au	54.8nm

Make sure your sample has been properly Baked when using PR or PMMA.

Samples must be cleaned in accordance to processing needs NO FLEXIBLE SUBSTRATES OF ANY KIND ARE ALLOWED IN THIS TOOL