Status	Up
Issue Date and Description	11/14/2025 Replacement of Cryopump complete. Testing of system is complete. 9/23/25 Cryopump failed. System will be down for approx 4-6 weeks. 7/17/2025 Top flange on chamber o-ring fail. Regeneration of cryopump is necessary. 4/9/25 Regeneration of Cryopump complete. 4/7/25 Student crashed the Cryopump. Down for regeneration.3/27/2025 Cryo showing sudden poor performance - either partial failure of the motor drive or contamination in the He line
Estimated Fix Date and Comment	0718/2025, regeneration finished, system back online.07/18/2025 4/9/25. 4/1/2025 Successful regeneration. He lines may need purge soon but tool is operating normally
Responding Staff	Dave Lubelski/Dan Witter

iLab Name	C - CHA E-Beam Evaporator #2
iLab Kiosk	BRK Evaporation Sputtering Core
FIC	Shared
Owner	Dave Lubelski
Location	Cleanroom - L Bay
Max. Wafer	4"/100 mm
Internal Page
Staff Page	Staff - CHA E-Beam Evaporator #2

Current Sources	Ti, Ag, Ni, Au, Pt, Al
Potential Sources	Ti, Au, Pt, Al, Ni, Ge, Cr, Ag, NiCr (80/20)

Overview

General Description

Telemark 861 deposition controller
Six pocket e-beam evaporator
Pockets hold 8.2 cc crucible liners
Substrate fixture can hold 1- 6" wafer 4" wafers with adapters for a 3" wafer, 2" wafer, and fragments of wafers
Water cooled stage

_{RESULTS FROM TOOL CHARACTERIZATION AS OF 1/24/2020}

material deposited on clean pattered wafer	deposition rate	thickness setting	characterized result
using PR lift off process measured on P7
CHA2
Ti	2 a/s	50 nm	49.9 nm
Au	2 a/s	50 nm	49.4nm
Ni	2 a/s	50 nm	48.3 nm
Pt	2 a/s	50 nm	51 nm
Ag	2 a/s	50 nm	48.8 nm
Ge	2 a/s	50 nm	49.8 nm
Ti	1 a/s	5 nm	5nm
Ti/Au	Ti 1 a/s Au 2/as	5 nm Ti 50nm Au	54.8nm

Make sure your sample has been properly Baked when using PR or PMMA.

Samples must be cleaned in accordance to processing needs NO FLEXIBLE SUBSTRATES OF ANY KIND ARE ALLOWED IN THIS TOOL