PVD Pulsed Laser Deposition (PLD) System

Owned by Former user (Deleted)
Last updated: Jan 28, 2022 by Hosler, Richard S

2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

Tool StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff


iLab KioskeLog: SubmiteLog: View/EditReport ProblemMSDS Documents



iLab NamePVD Pulsed Laser Deposition (PLD) System
iLab KioskBRK Evaporation Sputtering Core
FICAlexandra Boltasseva
OwnerDave Lubelski
LocationBRK 1217
Max. Wafer2"/50 mm
Internal Page/wiki/spaces/BNCWiki/pages/6236604

Overview

General Description

Versatile pulsed laser deposition system dedicated to oxides Manufacturer: PVD Products, Inc.

Specifications

  • Samples up to 2” diameter wafers
  • Max substrate temperature
    • sapphire = 800°C
    • silicon = 900°C
  • heating via IR lamps
  • Targets
    • three 2” dia. x 0.25” thick target holders
    • smaller target sizes possible
    • current available targets: Ag, Al, Co, Cr, Cu, Fe, Ga, In, Mo, Sc, Ta, Ti, V, W, Zr
  • Gases: O2
  • Laser source
    • Lambda Physik 305i KrF excimer laser (see manual below)
    • Laser rastering
    • uniform rastering across target via rotation and mirror
  • Chamber
    • loadlock
    • base pressure <810-8 Torr

Technology Overview 

Non-outgassing materials.


Sample Requirements and Preparation


Standard Operating Procedure


Questions & Troubleshooting



Process Library

References

 Coherent KrF Service Report (installation) (Internal Resource)