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Notes on using the SOP:

• Videos are for demonstration and learning assistance purposes but are not frequently updated.

• You must refer to the text of the SOP for full, proper, up-to-date information on operation, information, and important considerations.

• If there is a conflict between the content in the videos and the SOP text, the SOP text should be followed.

• Text in the SOP is somewhat color coded to assist the reader:

  • "Normal" text is black (or grey, in dark mode)

  • Important reminders and the names of buttons to press are in bold

  • Links are blue.

  • Safety, points of potential tool damage, or critical reminders are red with the “no entry” sign emoji to the left.

  • Background informational notes are purple.

• Use the drop down menus to get more information on each step of the SOP.

0 Software Update Notes - 20221215

1 Training Materials

2 Data Preparation

2.1 Layout

Create a layout in GDS or OAS formats (can also be others) using something like KLayout, LayoutEditor, L-Edit, or GdsPy.

2.2 8100calculator.xlsx

Use 8100calculator.xlsx to help determine your Shot Pitch and other write parameters.

2.3 Tracer (Optional) - Create PSF for PEC

If performing PEC on a new materials stack, use Tracer to export a PSF for import into Beamer. Tracer is available on the PC next to the JEOL itself.

2.4 Beamer - V30

In Beamer, Import → Heal → Export. In export, set shot pitch as appropriate. Then Run or Run to last box. For info on more advanced operation, watch the Beamer Webinar Material. Beamer is available on the PC next to the JEOL itself, and a remote computer (optional instructions for accessing the remote computer here).

2.5 Beamer - VisualJob creation of SDF and JDF files

Setup write parameters for the particular V30 file(s) to be written (Substrate → Global Mark → Layers → Arrays → Data to Place). Save, then Generate Jobdeck to make JDF and SDF files.

3 Machine Operation

3.1 Starting

1. Enable the JBX-8100FS in the BRK Lithography Core iLab Kiosk

2. Bring up the jbxwriter software. It may be minimized or on a different desktop tab (check the boxes in the lower right).

3. Check if a cassette is already on the stage, or if one is in the load lock. Proceed accordingly.

4. Check the set condition file; change the if necessary (Ensure Restore and DEMAG are checked)

3.2 Mount Sample onto Cassette

3.2.1 General Cassette Reminders

3.2.2 Wafer Cassette Mounting

Load wafer into cassette, ensuring wafer is flat and well aligned

3.2.3 Piece Cassette Mounting

1. Use correct spacer ring and ensure clips won’t block height laser

2. Mount sample

3. Adjust rotation as necessary (<1 degree for aligned writes, ideally <0.2 degrees, use 8100calculator.xlsx and verniers for easy fine adjustment).

4. Zero stage on LL Zero Landmark (pic, video).

5. Find chip edges/alignment marks with microscope.

6. Record location of chip center (unaligned write) or P mark (aligned write).

3.3 Load Cassette into Machine

1. Open Exchange Chamber Access door. At load lock, ensure "Cassette on stage" LED is off, then EVAC/VENT.

2. Open LL, place cassette into pouch, insert pouch into LL, then LOAD/UNLOAD. Close door.

3.4 Check Sample Height

1. In jbxwriter, set cassette in Cassette Type… button in Stage Control tab

2. Once cassette is loaded, go to sample center or P mark, check sample height with HEI button.

3.5 Material Corrections

3.5.1 Unaligned Exposure Material Corrections

In the Calibration Page, Material Corr. tab, click Load button, load 0_currentnA.mcorrprm. In the Beam Drift sub-tab, click Set BE Mark, then Execute, then LR Update, then LR Save.

3.5.2 Aligned Exposure Material Corrections

3.5.2.1 Find the P Mark

1. Find the P Mark with the SEM

2. Register the Substrate position in UsrMayRegist: P Mark.

3.5.2.2 Load your MCORRPRM file

Load previously created MCORRPRM file, or create a new one. If creating, load 0_currentnA.mcorrprm, save as alias_YYYYMMDD_currentnA_windowID_markpattern.mpcorrprm

3.5.2.3 Determine the P Mark Offset and Update Global Mark Detection Offset

Move to P Mark Design Position, select UsrMayRegist: P Mark, select Relative, type Target X/Y into Offset in the Global Mark Detection sub-tab, press LR Save, select back to Absolute.

3.5.2.4 If new MCORRPRM file: set parameters and perform AGC

1. Go to the Global Mark Detection sub-tab

2. Check only Global Mark Detection.

3. Set Global Mark Parameters: Material Type/Size/Window; Check Height Measurement; Enter P/Q/R/S design positions; Semiauto; 1 degree; press LR Save.

4. Setup for AGC: Check AGC, uncheck Q, R, S.

5. Set P Rough RG Detect Conditions: Scan Position X/Y = Scan Width X/Y = 3 * Wg, rest from 4.7 Example RG Detect Condition. Applies to another subprogram..., Mark Type All select, Subprogram that can be set, close, OK. Execute.

6. Once AGC completes: All select, OK.

7. Set P Fine RG Detect Conditions: Scan Position X/Y = 50% Lg, Scan Width X/Y = 3 * Wg, Applies to another subprogram..., Mark Type All select, deselect P rough, deselect Q rough, Subprogram that can be set, close, OK.

8. Set Q Rough RG Detect Conditions: Scan Position X/Y = 3 * Wg, Scan Width X/Y = 25 * Wg, OK.

9. Setup to run Global Mark Detection: Uncheck AGC, recheck Q, R, S. Press LR Save, Save MCORRPRM.

3.5.2.5 Perform Global Mark Detection

1. Go to the Global Mark subtab, ensure only the the Global Mark Detection check box is checked.

2. Click the Execute button.

3. If a mark isn't found: Continue, use SEM and move stage to unfound mark centers, OK.

4. If necessary, adjust scan position/scan widths to find all marks automatically. When successful, press LR Save, Save MCORRPRM.

3.5.2.6 Perform Chip Mark Detection (if using real chip marks)

If using a new MCORRPRM, first set parameters:

1. AGC unchecked, 4, Check Height Detection, Set design M1/M2/M3/M4 position, enter a design chip center X/Y.

2. RG Detect Conditions: Scan Tab: Scan Position X/Y = 40%*Lc, Scan Width X/Y = 3*Wc. Scan Type tab: Mark Width = Wc, Mark Length = Lc. Retry tab: 10, 0.5µm, 0.5µm. OK.

3. Execute. Adjust scan position/width if failing. When successful, Press LR Save, Save MCORRPRM.

3.5.2.7 Save the Beam Drift parameters

Update Beam Drift RG Detection Conditions

1. If using Global Marks but virtual chip marks. Global Mark sub-tab, P Fine RG Detect Condition, Applies to another subprogram..., select Drift (fine), Subprogram that can be set, close, OK.
   OR

2. If using Global Marks AND physical Chip Marks. Chip Mark sub-tab, RG Detect Condition, Applies to another subprogram..., select Drift (fine), Subprogram that can be set, close, OK.

3.6 Run DAILYCAL

1. 15 to 40 minutes after changing currents, go to Batch tab.

2. Ensure DAILYCAL is loaded, with list on right of: Beam Current Measurement, AE Mark Detection, AE Mark Detection, Static Focus Correction, BE Mark Detection, BE Mark Detection, Main DEF Correction, Sub DEF Correction, Distor Correction, Save.

3. Execute DAILYCAL batch calibration file.

3.7 VisualJob (Beamer) and Magazine File

1. If not done before, while JOBCAL runs (or whenever), on Beamer PC, launch Beamer and run visual-Job as described in Data Prep - 5: Beamer- VisualJob above.

2. Use USB stick to transfer all relevant JDF, SDF, and V30 files from Beamer PC F:/alias/thisexposure folder to Linux PC within job/user/alias/thisexposure.

3. Within job/user/alias/thisexposure, open (display) SDF text file, update Offset to Global Mark Detection Offset. or measured chip center in alignment microscope, Save, close text editor.

4. Launch SCHD GUI (SCHD Purple Square), drag SDF, compile job, ensure no errors, close.

3.8 Expose

1. In jbxwriter Exposure page, remove any magazine files in Queue, open your MGN(s), Start Exposure.

2. Watch to ensure exposure completes DIRE20 and mark detection (if doing an aligned write), and exposure of pattern begins.

3.9 Unload Cassette from Machine

1. Ensure cassette is at origin (Stage Coordinate System ~100/100). Cassette should move here automatically after a successful exposure.

2. Open Exchange Chamber Access Door. At LL, ensure LOAD/UNLOAD button is green and all 3 side LEDs are lit, hold LOAD/UNLOAD to unload cassette to LL and automatically vent LL.

3. Open LL, remove cassette from pouch, insert pouch into LL, hit the EVAC/VENT button. Close door.

3.10 Finishing

1. Load current for next user, if they have indicated a current in iLab.

2. Dismount your sample(s) from cassette, place cassette back in plastic box.

3. Ensure the height rings are properly arranged.

4. Close Beamer, log out of Beamer PC.

5. Disable 8100 in iLab Kiosk

4 Supplements

4.1 Cassette Window Identifiers

4.2 Example SEM Values

4.3 Example Mark Location

4.4 Example Mark Composition

4.5 Example Mark Dimension

4.6 Example Mark Scan Parameters

4.7 Example RG Detect Condition

Return to 3.5.2.4

5 Frequently Asked Questions

5.1 What if jbxwriter software is not up when I come to the machine?

5.2 How can I check if the beam is on?

5.3 How can I execute a Height Map?

5.4 What do I do if I see a Load Error (ebloaderd)? How can I avoid it?

5.5 What do I do if AE or BE Mark detection fails?

5.6 What do I do if Beamer has an "all licenses are in use error"?

5.7 Why am I getting a CHIPAL error?

5.8 Why is the beam drift correction not executing properly?