Photoresist Dry Film Laminator

Owned by Former user (Deleted)
Last updated: Aug 29, 2019 by Wirth, Justin C
1 min read


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff


iLab Name: Thick Film Photoresist Laminator
iLab Kiosk: BRK Lithography Core
FIC: Michael Sinani
Owner: Michael Sinani
Location: Cleanroom - N Bay
Maximum Wafer Size: 

Overview

General Description

The dry photoresist laminator allows application of dry-film photosensitive films for complete substrate protection and/or patterning. It can be used for semiconductor wafers or PCBs.

Specifications

Will handle a substrate up to 10" wide.

Technology Overview

 Si and PCB/FR4.

 

Sample Requirements and Preparation

 

Standard Operating Procedure


Questions & Troubleshooting


 

Process Library

References