Photoresist Dry Film Laminator

Owned by Former user (Deleted)
Last updated: Aug 29, 2019 by Wirth, Justin C

2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff


iLab Name: Thick Film Photoresist Laminator
iLab Kiosk: BRK Lithography Core
FIC: Michael Sinani
Owner: Michael Sinani
Location: Cleanroom - N Bay
Maximum Wafer Size: 

Overview

General Description

The dry photoresist laminator allows application of dry-film photosensitive films for complete substrate protection and/or patterning. It can be used for semiconductor wafers or PCBs.

Specifications

Will handle a substrate up to 10" wide.

Technology Overview

 Si and PCB/FR4.

 

Sample Requirements and Preparation

 

Standard Operating Procedure


Questions & Troubleshooting


 

Process Library

References