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Suss MA6 Mask Aligner

Suss MA6 Mask Aligner

Jun 19, 2025

Status

UP

Issue Date and Description

 

Estimated Fix Date and Comment

 

Responding Staff

 

MA6 - Internal Resources

MA6 Staff Page (Restricted)

 

iLab Name: MA6
iLab Kiosk: BRK Lithography Core
FIC: David Janes
Owner: Joon Park
Location: Cleanroom - N Bay
Maximum Wafer Size: 4"/100 mm

Overview

General Description

The Suss MA/BA6 UV 400 Mask and Bond Aligner is used to expose 4" wafers with 5" photomasks. Back side alignment is available. Limited use of smaller substrates for backside alignment may be possible with a 2" chuck, please contact BNC staff for more info if interested.

Specifications

Exposure

  • Light source: 350 W Mercury Short-arc lamp (UV400).

  • Exposure wavelengths: 350-450 nm, covering the g-line (436 nm), h-line (405 nm), and i-line (365 nm)

  • Output power: 

  • Intensity Uniformity: ±5%

  • Gap Setting Accuracy: 1 μm

  • Proximity Exposure Gap: 1-999 μm

Alignment Accuracy:

  • Top Alignment: ± 0.5 μm

  • Backside Alignment: ± 1 μm

  • Bond Alignment: ± 0.5 μm

Maximum Resolution, by contact type

  • Proximity (20 μm gap): <3.0 μm

  • Soft contact: <2.5 μm

  • Hard contact: <1.5 μm

  • Vacuum contact: <0.8 μm

Alignment Stage

  • X travel: ±10 mm

  • Y travel: ±5 mm

  • Theta range: ±5°

  • Mechanical alignment stage accuracy: 0.1 μm (step size)

TSA Microscope Stage:

  • X: ±25 mm

  • Y: ±15/-75 mm

  • Theta: ±3°

  • Split Field objective Separation: 32-160 mm

BSA Splitfield Microscope:

  • Objective Separation: 15-100 mm

  • Movement Range: Y:+50/-20 mm

  • Field of View: 0.92 x 0.69 mm²

 

Sample Requirements and Preparation

Samples should be cleaned and prepared with further processing steps in mind, as well as conditions that enable good adhesion between the substrate and photoresist.

For the aligner itself, samples must be free of resist on the substrate backside. If any resist or residue is present, it should be removed with the following process:

  1. Put on a clean, new pair of solvent gloves.

  2. In a solvent hood (with appropriate PPE), squirt some acetone on either a cleanroom wipe, a cleanroom swab, or a polyester wipe.

  3. Hold the sample firmly with tweezers, or if necessary, with clean, double gloved hands. Note that holding with hands is only recommended if the gloved hand has touched NOTHING since being put on.

  4. Carefully wipe the wafer backside with the wipe/swab, making sure not to touch the substrate front side. Acetone can wick into resist, and so should only areas of resist to be removed.

  5. Repeat as necessary to remove any residue.

 

Standard Operating Procedure

Stage & Microscope Drifting Error Prevention

  1. Please move back and forth or shake two joysticks before turning on power.

  2. Do not use xy joystick. It is not accurate. Please use xy arrow button. For rotation, you can use the joystick left side.

  3. Please be patient to use BSA/TSA/STG button. After changing the mode, please wait at least 1 second before moving the stage. You navigated your sample and mask very fast.

  4. Once you find that the stage or microscope did not stop, please press BSA/TSA/STG button and wait for 1 second, until it stopped.

  5. When you loading wafer, if you get vacuum loss error, please unload and clean your sample.