Finetech Fineplacer Lambda 2 Flip Chip Bonder
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Issue Date and Description |
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iLab Name | Finetech Fineplacer Lambda 2 Flip Chip Bonder |
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iLab Kiosk | |
FIC | |
Owner | |
Location | BRK 2087 |
Max. Wafer | 4” / 100 mm |
Info Links |
Overview
General Description
The Lambda 2 is a table top die bonding platform for precise dispensing and the placement of microstructures.
Specifications
Placement accuracy: ± 0.5 µm
Field of view (min)1: 0.55 mm x 0.45 mm
Field of view (max)1: 6.7 mm x 5.4 mm
Component size (min)1: 0.1 mm x 0.1 mm
Component size (max)1: 15 mm x 15 mm
Theta fine travel: ± 5°
Z-travel: 10 mm
Working area1: 190 mm x 52 mm
Bonding force range2*: 0.1 N - 400 N
Heating temperature (max)1,2*: 400 °C
Manual Bonding force Module
Process gas module: Forming gas
Dispenser module: For adhesive dispensing
Manual optics shifting: 40 mm
Process video module
Substrate requirements:
Substrate size: 100mmx100mm
Substrate height: 10 mm
Technology Overview - Remove if multiple tools use the same technology/process
Description of the science behind the process. Include figures and diagrams if applicable.
Sample Requirements and Preparation
Samples that may be used in the tool, materials that are compatible/incompatible, and the required cleaning before the tool may be used. May include both an "ideal" clean and a minimum required clean. Also include BOE/oxide removal, dehydration, or any recommended post process steps.
Standard Operating Procedure
Standard procedure for tool operation, base off established Birck SOPs.
Process Control Information
Process Control Context
Process Control Charts
Questions & Troubleshooting
Question about tool use or process result?
Answer to question.
Process Library
Create process template for tool, allows a user to fill in the details of their process.
References
Manufacturer brochures, specifications, papers with relevant info on process, and presentations covering the technology. Confluence lacks a native reference feature, so these are added as links.