JFP WB-100 Wire Bonder

Owned by Wirth, Justin C
Last updated: Feb 05, 2019
1 min read


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description


Estimated Fix Date and Comment

Responding Staff


iLab Name: JFP Wire Bonder
iLab Kiosk: BRK Packaging and Assembly Core
FIC: David Janes
Owner: Tim Miller
Location: BRK 2092
Maximum Wafer Size:  

 

Overview

General Description

This precision tool welds gold wire from chip pad to package. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

Specifications

The JFP WB-100 is a general purpose wire bonder.  It is capable of ball, wedge, and ribbon bonding, HOWEVER the changeover from one mode to another is non-trivial, therefore it is usually set up for ball bonding with 1 mil (25 micron) gold wire.

Technology Overview 

 

 

Sample Requirements and Preparation

No special sample cleaning is required prior to wire bonding.  Sample metallization must be thick enough to withstand the rigors of bonding.  Samples must be securely mounted in their respective packages, and the package must be securely mounted to the bonding fixture.  Double-sided cellophane tape is not an acceptable mounting technique.  

 

Standard Operating Procedure


Questions & Troubleshooting


 

Process Library

References