Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

Status	UP
Issue Date and Description	5/16/24 Laptop and contactor installation successful. Magnetron must be installed and tested still
Estimated Fix Date and Comment	5/17 Plasma lights on installed magnetron
Responding Staff	Dave Lubelski/Dan Witter

iLab Kiosk	eLog: Submit	eLog: View/Edit	Report Problem	MSDS Documents

iLab Name	C - PVD Sputtering System - 4 Target Magnetic Sources
iLab Kiosk	BRK Evaporation Sputtering Core
FIC	Joerg Appenzeller
Owner	Dave Lubelski
Location	Cleanroom - S Bay
Max. Wafer	4"/100 mm

Current Sources	Co (restricted use), Fe (restricted use), Cu, Ta
Potential Sources	Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo

Overview

General Description

Magnetic sputtering system

Specifications

DC/RF sputtering system, Base pressure of 2x10-6 torr, reactive sputtering capable, Materials include: Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo, heated stage capable of 450 degrees C

Technology Overview

_{No Organics/Polymers Allowed}

Sample Requirements and Preparation

Standard Operating Procedure

Please Note: This instrument is billed per use based on a 2 hour block

Example : 1 user only uses the tool per use. When you vent the system and unload your sample that concludes your reservation .

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses

Questions & Troubleshooting

Birck Nanotechnology Center Wiki

PVD Sputtering System - 4 Target Magnetic Sources