PVD Sputtering System - Nitride

Owned by Former user (Deleted)
Last updated: Jun 19, 2024 by David A Lubelski

2024-12-20 to 2025-01-02: Reduced Holiday Operations

Dear Birck Research Community,

The Purdue winter recess begins effective Friday afternoon December 20th and concludes Thursday morning, January 2. The university is officially closed during this time. As we have done in past years, the Birck Nanotechnology Center will remain available for research but will be unstaffed and hazardous gasses will be unavailable. Lab work may otherwise proceed, though any fume hood work must be done with someone else present in the same laboratory or cleanroom bay (the "buddy" system). Click the link above to get more detail about equipment conditions and rules.


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description

6/19/2024. Software and hardware issues resolved. System ready to use.


Estimated Fix Date and Comment

Responding Staff


iLab KioskeLog: SubmiteLog: View/EditReport ProblemMSDS Documents



iLab NamePVD Sputtering System - Nitride
iLab KioskBRK Evaporation Sputtering Core
FICVlad Shalaev
OwnerDave Lubelski
LocationBRK 1217
Max. Wafer2"/50 mm

Overview

General Description

  • Versatile sputtering system for the deposition of metals and nitrides
  • Manufacturer: PVD Products, Inc.

Specifications

  • samples up to 2” diameter wafers
  • max substrate temperature
    • sapphire = 800°C
    • silicon = 900°C
  • targets
    • four 2” magnetron sputter sources
    • current available targets: Ag, Al, Co, Cr, Cu, Fe, Fe-Al, Ga, In, Mo, Sc, Ta, TaN, Ti, TiN, V, W, Zr, ZrN
  • gases: Ar, N2, NH3
  • power supplies
    • three 500W DC power supplies
    • one 13.54 MHz, 300W RF power supply
  • chamber
    • loadlock
    • base pressure <8x10-8 Torr
    • two quartz crystal monitors for in-situ thickness measurement

Technology Overview 


Sample Requirements and Preparation


Standard Operating Procedure


Questions & Troubleshooting



Process Library

References