PVD Sputtering System - 4 Target Magnetic Sources

PVD Sputtering System - 4 Target Magnetic Sources

Status

Down

Issue Date and Description

10/13/2025 Z-stage was crashed into the substrate shutter and the stage is destroyed

Estimated Fix Date and Comment

Awaiting lead time on replacement parts

Responding Staff

Dave Lubelski/Dan Witter

iLab Name

C - PVD Sputtering System - 4 Target Magnetic Sources

iLab Kiosk

BRK Evaporation Sputtering Core

FIC

Joerg Appenzeller

Owner

Dave Lubelski

Location

Cleanroom - S Bay

Max. Wafer

4"/100 mm

 

Current Sources

Co20Fe60B (at%), MgO, Ru, Ta

Potential Sources

Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo

Overview

General Description

Magnetic sputtering system

Specifications

DC/RF sputtering system, Base pressure of 2x10-6 torr, reactive sputtering capable, Materials include: Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo, heated stage capable of 450 degrees C

Technology Overview

 No Organics/Polymers Allowed

 

Sample Requirements and Preparation

 

 

Standard Operating Procedure

Please Note: This instrument is billed per  use  based on a 2 hour block

Example : 1  user only uses the tool  per use.  When you vent the system and unload your sample that concludes your reservation .  

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses

Questions & Troubleshooting


 

Process Library


References