PVD Sputtering System - 4 Target Magnetic Sources

PVD Sputtering System - 4 Target Magnetic Sources

Status

Problem

Issue Date and Description

5/1/2026 Stage is off alignment by about 20 degrees, possibly due to power outage issues 2/25/26 Back-right magnetron (Ru source) will not light plasma

Estimated Fix Date and Comment

Stage is properly aligned. Back right magnetron is shorted and likely needs to be sent back to manufacturer for rebuild

Responding Staff

Dave Lubelski/Ethan Zhang

iLab Name

C - PVD Sputtering System - 4 Target Magnetic Sources

iLab Kiosk

BRK Evaporation Sputtering Core

FIC

Joerg Appenzeller

Owner

Dave Lubelski

Location

Cleanroom - S Bay

Max. Wafer

4"/100 mm

 

Current Sources

Co20Fe60B (at%), MgO, Ru, Ta

Potential Sources

Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo

Overview

General Description

Magnetic sputtering system

Specifications

DC/RF sputtering system, Base pressure of 2x10-6 torr, reactive sputtering capable, Materials include: Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo, heated stage capable of 450 degrees C

Technology Overview

 No Organics/Polymers Allowed

 

Sample Requirements and Preparation

 

 

Standard Operating Procedure

Please Note: This instrument is billed per  use  based on a 2 hour block

Example : 1  user only uses the tool  per use.  When you vent the system and unload your sample that concludes your reservation .  

Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses

Questions & Troubleshooting


 

Process Library


References