PVD Sputtering System - 4 Target Magnetic Sources
Status | Down |
|---|---|
Issue Date and Description | 10/13/2025 Z-stage was crashed into the substrate shutter and the stage is destroyed |
Estimated Fix Date and Comment | Awaiting lead time on replacement parts |
Responding Staff | Dave Lubelski/Dan Witter |
iLab Name | |
|---|---|
iLab Kiosk | |
FIC | Joerg Appenzeller |
Owner | |
Location | Cleanroom - S Bay |
Max. Wafer | 4"/100 mm |
Current Sources | Co20Fe60B (at%), MgO, Ru, Ta |
|---|---|
Potential Sources | Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo |
Overview
General Description
Magnetic sputtering system
Specifications
DC/RF sputtering system, Base pressure of 2x10-6 torr, reactive sputtering capable, Materials include: Ta, Ru, MgO, Cu, W, NiFe, CoFeB, Mo, heated stage capable of 450 degrees C
Technology Overview
No Organics/Polymers Allowed
Sample Requirements and Preparation
Standard Operating Procedure
Please Note: This instrument is billed per use based on a 2 hour block
Example : 1 user only uses the tool per use. When you vent the system and unload your sample that concludes your reservation .
Example: If the usage is 10+ minutes past the initial 2 hour reservation, you will be billed for 2 uses
Questions & Troubleshooting
Process Library
References