PVD Sputtering System - Metal/Dielectric Sources

Owned by Former user (Deleted)
Last updated: Apr 25, 2024 by Witter, Daniel Joseph
1 min read


Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

StatusUP
Issue Date and Description

1/9/2024 Issue seems to be limited only to the front-right magnetron; other 3 sources are normal

Estimated Fix Date and Comment

Responding StaffDave Lubelski/Dan Witter


iLab KioskeLog: SubmiteLog: View/EditReport ProblemMSDS Documents


iLab NameC - PVD Sputtering System - Metal/Dielectric Sources
iLab KioskBRK Evaporation Sputtering Core
FICPeter Bermel
OwnerDave Lubelski
LocationCleanroom - S Bay
Max. Wafer4"/100 mm


Current Sources

Cr, W, Cu, Au

Potential SourcesSi,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, NbTi, W3Si4, TiO2, Si3N4, SiO2, TiN, MoSi2, Ru

Overview

General Description

Metal/dielectric sputtering system

Specifications

DC/RF sputtering capable, 2" targets, base pressure 2x10-6 torr, materials include: Si,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, WSi4, TiO2, Si3N4, SiO2, water cooled stage

Technology Overview 

No Organics/Polymers Allowed


Sample Requirements and Preparation


Standard Operating Procedure

Note 1: This instrument is billed "per use based on a 2 hour block.

Note 2:  Please observe only 1 user per session.  Your reservation concludes when you vent the system and unload your sample.  

Example: If the usage is 10+ minutes past the 2 hour reservation, you will be billed for 2 uses.



Questions & Troubleshooting



Process Library

References