Refer to the Material and Process Compatibility page for information on materials compatible with this tool.
Equipment Status: Set as UP, PROBLEM, or DOWN, and report the issue date (MM/DD) and a brief description. Italicized fields will be filled in by BNC Staff in response to issues. See Problem Reporting Guide for more info.

Status	UP
Issue Date and Description	10/28/2024 Breaker work delayed, cancel previous plan
Estimated Fix Date and Comment
Responding Staff	Dave Lubelski/Dan Witter

iLab Kiosk	eLog: Submit	eLog: View/Edit	Report Problem	MSDS Documents

iLab Name	C - PVD Sputtering System - Metal/Dielectric Sources
iLab Kiosk	BRK Evaporation Sputtering Core
FIC	Peter Bermel
Owner	Dave Lubelski
Location	Cleanroom - S Bay
Max. Wafer	4"/100 mm

Current Sources	Ta2O5, Ti, SiO2, W
Potential Sources	Si,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, NbTi, W3Si4, TiO2, Si3N4, SiO2, TiN, MoSi2, Ru

Overview

General Description

Metal/dielectric sputtering system

Specifications

DC/RF sputtering capable, 2" targets, base pressure 2x10-6 torr, materials include: Si,Cr, Ge, Ag, Cu, Al, Ti, Ta, W, Au, Nb, WSi4, TiO2, Si3N4, SiO2, water cooled stage

Technology Overview

_{No Organics/Polymers Allowed}

Sample Requirements and Preparation

Standard Operating Procedure

Note 1: This instrument is billed "per use based on a 2 hour block.

Note 2: Please observe only 1 user per session. Your reservation concludes when you vent the system and unload your sample.

Example: If the usage is 10+ minutes past the 2 hour reservation, you will be billed for 2 uses.

Questions & Troubleshooting

Birck Nanotechnology Center Wiki

PVD Sputtering System - Metal/Dielectric Sources