At Birck, over 30 systems provide a variety of methods to deposit over 60 different metals, dielectrics, and organics. Capabilities include:

  • Atomic Layer Deposition (ALD)
  • Chemical Vapor Deposition (CVD)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • High Density Plasma CVD (HDPCVD)
  • E-beam Evaporation
  • DC/RF Sputtering
  • multi-deposition (E-Beam Evaporation + Sputtering)
  • GaN Molecular Beam Epitaxy (MBE)
  • PVD Pulsed Laser Deposition (PLD)
  • Electrodeposition

Staff contact: Ron Reger

List of currently available materials for deposition

Evaporator Sources

Sputterer Sources