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Overview

General Description

Wafer-scale semi-automatic vacuum probe station equipped with 4 DC and 2 RF (to 67 GHz) probes as well as a probe card feedthrough. The chuck can be heated to 300 C, and can also be voltage biased for body-biasing. Adapters for clamping arrays of 5x5mm or 10x10mm coupons are also provided.

Specifications

Vacuum from 1e-4 torr up to atmosphere in air or N2.
Chuck temperature from 20 C up to 300 C.
Chuck biasing from -40 V to +40V DC.
Sample size: 8" wafer, 5x5mm or 10x10mm coupon. Adapters to other sample sizes can be purchased.
2x RF probes are G-S-G design with 150 um pitch and rated up to 67 GHz.
On-board software control allows semi-auto die-scale array probing (probes lift-move-drop) integrated with measurements on parameter analyzer or other electronics.

Technology Overview - Remove if multiple tools use the same technology/process

 Description of the science behind the process. Include figures and diagrams if applicable.

Sample Requirements and Preparation

Samples that may be used in the tool, materials that are compatible/incompatible, and the required cleaning before the tool may be used. May include both an "ideal" clean and a minimum required clean. Also include BOE/oxide removal, dehydration, or any recommended post process steps.

Standard Operating Procedure

Standard procedure for tool operation, base off established Birck SOPs.

Process Control Information

Process Control Context

Process Control Charts

Questions & Troubleshooting

Question about tool use or process result?
Answer to question.

Process Library

Create process template for tool, allows a user to fill in the details of their process. 

References

Manufacturer brochures, specifications, papers with relevant info on process, and presentations covering the technology. Confluence lacks a native reference feature, so these are added as links.